HEXAspec

HEXAspec is a deep-tech spinout from Rice University. Today, AI and software may be “eating the world,” but they still need hardware powerful enough to chew it. We focus on thermal management solutions for all semiconductor chips, enabling more powerful hardwares for Edge AI. HEXAspec develops advanced semiconductor molding compounds with 10× higher thermal conductivity than conventional epoxies, enabling improved heat dissipation at the package level while maintaining electrical insulation and manufacturing compatibility.

• Tianshu Zhai

  CEO